CMIt Analysis System
MERCURY – Defect Re-inspection Software
Overview
- MERCURY is one of the core modules within the LUNA® software ecosystem, specifically designed for inspection report re-verification to optimize secondary verification workflows in semiconductor manufacturing processes. The system efficiently reads and compares inspection reports from multiple sources—including KLA, SINF, TSK, and customized formats—enabling engineers to perform cross-source verification and ensure data consistency and reliability.
- The system provides a dual-layer verification mechanism at both the defect level and die level, and supports defect review as well as conditional re-verification. Through user-defined rules, engineers can automate the filtering, comparison, and confirmation of specific defects or parameter conditions, further improving verification efficiency and consistency in interpretation.
Key Features
- Dual-Layer Verification Mechanism – Supports verification at both the defect level and die level simultaneously.
- Defect Review – Provides flexible tools for defect review and validation.
- Conditional Re-Verification – Enables rule-based filtering, comparison, and confirmation of specific defects or parameter conditions.
- Visualization and Automation – Delivers intuitive dashboards and automated review workflows to improve operational efficiency and strengthen decision-making.
- Reference Die Image Comparison – Supports integration of reference die images (such as Golden Die or CAD), enabling rapid comparison and defect identification based on actual die locations.
VENUS - Defect Analysis Software
Overview
- VENUS is a data analytics module within the LUNA® software ecosystem, designed specifically for the semiconductor industry. The system efficiently processes report data generated from wafer testing and packaging processes, including KLA, SINF, TSK, and customized formats, and provides comprehensive statistical analysis, trend analysis, and yield analysis capabilities.
- By integrating key indicators such as IQM (Intelligent Quality Management) and defect distribution, VENUS enables engineers to accurately monitor process performance and quickly identify potential root causes of process anomalies. Combined with a flexible visualization interface and automated report generation, the system significantly improves analysis efficiency, supports informed decision-making, and accelerates yield improvement.
Key Features
- In-Depth Analytics – Provides statistical analysis, trend monitoring, and yield analysis.
- Process Anomaly Identification – Quickly identifies potential root causes of process issues.
- Visualization and Automation – Delivers intuitive dashboards and automated report generation.
- Efficiency and Yield Improvement – Enhances analysis efficiency, supports decision-making, and accelerates yield ramp-up.
- Batch Integration and Defect Distribution Analytics – Supports multi-lot integrated analysis, defect hotspot mapping, comprehensive defect overview, and integrated defect drill-down to identify spatial distribution patterns and deliver deeper yield insights.
MARS - 3D Metrology Data Analysis Software
Overview
- MARS is a 3D metrology data analytics module within the LUNA® software ecosystem, purpose-built for advanced packaging processes, with a focus on bump structures and wafer and die warpage analysis. Through precise data processing and visualization tools, engineers can effectively evaluate bump height, diameter, coplanarity, as well as die and wafer warpage conditions, enabling the identification of process variations, yield improvement, and enhanced reliability.
- MARS uses the CMIt file format as the standard input to ensure data consistency and integrity. It supports statistical analysis, report generation, and process monitoring, making it suitable for applications ranging from R&D validation and high-volume manufacturing process control to yield improvement initiatives.
Key Features
- Comprehensive Bump Analysis – Measures bump height, diameter, and coplanarity, and supports distribution analysis, filtering, and trend analysis.
- Die and Wafer Warpage Analysis – Provides accurate warpage measurements with support for hotspot mapping and trend visualization.
- Dedicated Data Processing Framework – Utilizes standardized file formats to ensure data consistency and processing efficiency.
- Visualization and Statistical Analysis Tools – Built-in charts and analytical tools enable rapid data interpretation.
- Quality and Yield Analysis – Delivers yield calculation, anomaly detection, and quality assessment capabilities.
