Options

  • Double-sided inspection with flipping module
  • Fluorescence inspection
  • Edge-contact automation transfer

Inspection

µEagleEye / µPlayLight

µLED 2D Inspection and Metrology

Designed specifically for μLED processes, the system detects missing, rotation, and shift defects to ensure high yield and reliable quality.

Options

  • Double-sided inspection with flipping module
  • Fluorescence inspection
  • Edge-contact automation transfer

Key Features

  • COW/COC 4", 6" wafer
  • Double-sided inspection with flipping module
  • Full-map metrology of die shift and rotation
  • Optional fluorescence inspection module (R-LED/GB-LED)
  • Edge-contact automated handling reduces the risk of surface damage to the wafer

Related Products

Argus

The Argus system is optimized for multi-layer RDL and interposer structures, ensuring accurate defect detection and measurement. With its innovative optical design and advanced algorithms, Argus effectively minimizes interference from underlying layers, enabling precise identification of critical defects to meet the stringent requirements of advanced packaging.

Phantom

The Phantom Series covers a broad range of applications, including Fan-Out Panel-Level Packaging, memory, power devices, RF devices, and MEMS.

Buffalo

Buffalo is designed for post-die-saw inspection, providing high-speed and high-sensitivity optical detection of defects such as chipping, cracks, and particle contamination.

OptiCore

Enables precise dimensional measurement of optical components and accurate multi-layer III-V thin-film thickness characterization for CPO applications.

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