Metrology
TopoX
3D Metrology on Wafer Surface Scan
3D Measuring:BOW、Warp、Sori、TTV、LTV、Thickness
| Metrology Capability | |
| 3D Measuring | Bow |
| Warp | |
| Sori | |
| TTV | |
| LTV | |
| Thickness |
Key Features
- Support 4” 、6”、8”、12” wafer
- Wafer thickness 200μm ~ 2000μm
- High resolution 3D sensor module
- Flexible customized software
- Easy to use GUI for 3D application
- Fully automated operation
- Import / Export file function
- Export measuring reports
- 3D Accuracy 100nm
