Options

  • Optional μBump 3D metrology
  • Optional fluorescence inspection

Inspection

Phantom

Large Panel Defect inspection + 3D Bump Metrology​

The Phantom Series covers a broad range of applications, including Fan-Out Panel-Level Packaging, memory, power devices, RF devices, and MEMS.

Options

  • Optional μBump 3D metrology
  • Optional fluorescence inspection

Key Features

  • Support 510×515, 600×600, 700×700mm panel, THK from 400-4000μm, high-warp panel (<10mm)​
  • TLI for multi-layer RDL
  • Multi-parameter scanning in a single cycle ​(focus, magnification, illumination, sensitivity, and detection engines)

Related Products

Argus

The Argus system is optimized for multi-layer RDL and interposer structures, ensuring accurate defect detection and measurement. With its innovative optical design and advanced algorithms, Argus effectively minimizes interference from underlying layers, enabling precise identification of critical defects to meet the stringent requirements of advanced packaging.

Buffalo

Buffalo is designed for post-die-saw inspection, providing high-speed and high-sensitivity optical detection of defects such as chipping, cracks, and particle contamination.

OptiCore

Enables precise dimensional measurement of optical components and accurate multi-layer III-V thin-film thickness characterization for CPO applications.

µEagleEye / µPlayLight

Designed specifically for μLED processes, the system detects missing, rotation, and shift defects to ensure high yield and reliable quality.

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