Inspection

OptiCore

2D Inspection + Thin Film THK Metrology​

Enables precise dimensional measurement of optical components and accurate multi-layer III-V thin-film thickness characterization for CPO applications.

Key Features

  • High-sensitivity defect inspection 0.25 µm​
  • Defect size classification
  • High accuracy thin film thickness systems. (10nm)​
  • Optical components inspection
  • Optical component dimensional measurement with GDS-based comparison
  • Full-map multi layer film thickness measurement​
  • Wafer automation
  • Class 1

Related Products

Argus

The Argus system is optimized for multi-layer RDL and interposer structures, ensuring accurate defect detection and measurement. With its innovative optical design and advanced algorithms, Argus effectively minimizes interference from underlying layers, enabling precise identification of critical defects to meet the stringent requirements of advanced packaging.

Phantom

The Phantom Series covers a broad range of applications, including Fan-Out Panel-Level Packaging, memory, power devices, RF devices, and MEMS.

Buffalo

Buffalo is designed for post-die-saw inspection, providing high-speed and high-sensitivity optical detection of defects such as chipping, cracks, and particle contamination.

µEagleEye / µPlayLight

Designed specifically for μLED processes, the system detects missing, rotation, and shift defects to ensure high yield and reliable quality.

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