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Inspection

Buffalo

2D Inspection for Die Saw​

Buffalo is designed for post-die-saw inspection, providing high-speed and high-sensitivity optical detection of defects such as chipping, cracks, and particle contamination.

Key Features

  • Multi-magnification inspection and metrology capabilities
  • Supports multiple illumination modes, including brightfield, darkfield, and various wavelengths
  • Supports automated handling of 8" / 12" film frame carriers
  • High-speed multi-magnification color inspection
  • Inspection of post-dicing wafer defects, including chipping, cracks, scratches, and probe mark inspection
  • Inspection for non-patterned wafers and glass wafers

Related Products

Argus

The Argus system is optimized for multi-layer RDL and interposer structures, ensuring accurate defect detection and measurement. With its innovative optical design and advanced algorithms, Argus effectively minimizes interference from underlying layers, enabling precise identification of critical defects to meet the stringent requirements of advanced packaging.

Phantom

The Phantom Series covers a broad range of applications, including Fan-Out Panel-Level Packaging, memory, power devices, RF devices, and MEMS.

OptiCore

Enables precise dimensional measurement of optical components and accurate multi-layer III-V thin-film thickness characterization for CPO applications.

µEagleEye / µPlayLight

Designed specifically for μLED processes, the system detects missing, rotation, and shift defects to ensure high yield and reliable quality.

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