Inspection
Argus
Multi-layer RDL (interposer) Inspection System
The Argus system is optimized for multi-layer RDL and interposer structures, ensuring accurate defect detection and measurement. With its innovative optical design and advanced algorithms, Argus effectively minimizes interference from underlying layers, enabling precise identification of critical defects to meet the stringent requirements of advanced packaging.
Key Features
- Support 6”, 8”, 12” wafer & 310x310mm panel, wafer THK from 400-2500μm
- Defect sensitivity down to 0.7 µm
- TLI for multi-layer RDL 2μm/2μm
- Support one die one wafer (Die size 280mm)
