Post Dicing

Post Dicing refers to the inspection process performed after wafer singulation, focusing on individual dies to ensure cutting quality and die integrity, and to prevent defects from propagating into subsequent packaging and advanced packaging processes. As applications such as Fan-out, 2.5D/3D IC, and HBM continue to expand, requirements for individual die quality have become increasingly stringent, making Post Dicing inspection a critical step impacting overall yield and reliability. During the Post Dicing process, cutting-induced stress may lead to edge chipping and micro-cracks, while process variations during singulation may result in die shift and residual defects. Some of these issues are difficult to detect and, if not identified in a timely manner, may pose risks to downstream alignment, stacking processes, and long-term reliability. ​

CMIt has developed dedicated inspection technologies for detecting sidewall cracks on individual dies, enabling early identification of critical defects. The system supports a wide range of workpiece types and size configurations, providing high process flexibility to accommodate different manufacturing stages and high-volume production environments.