Application
PMI (Probe Mark Inspection)
Overview
- Probe Mark Inspection (PMI) is crucial for product quality, accurately detecting probe marks and defects that impact yield. Our automated solutions ensure data accuracy, preventing short-term or long-term test failures.
- PMI provides key data (size, percentage on bond pad, count, distance to edge, and shift) to identify probing issues from the prober or probe card, allowing for precise process adjustments. Our advanced solutions also detect and measure wafer probing damage, improving production and yield in high-volume environments. Ultimately, PMI's detailed inspection and dynamic searching enhance reliability and efficiency.
Capabilities
- Inspect key features of probe mark such as size, percentage on bond pad, count, distance to edge, and shift.
- While inspecting wire-bond pads, the system dynamically searches and retrieves relevant data.
