Hybrid Bonding

Hybrid Bonding (HB) is a key technology driving heterogeneous integration and 3D packaging, widely adopted in HPC, AI, stacked memory(HBM), and CMOS image sensors(CIS). It delivers breakthrough value for next-generation HPC, imaging, and automotive applications.​HB has the potential to achieve ultra-high-density interconnects, but still faces challenges such as bonding quality, alignment accuracy, surface planarity, and the integration of different materials, including Cu–Cu and SiO₂–SiO₂ interfaces.

CMIt HB AOI inspection platform, built on high-resolution optics, 3D metrology, and AI-based defect classification, enables effective defect detection along with comprehensive wafer-level alignment and planarity inspection. With this solution, customers can reduce process risks, improve yield, and accelerate high-volume manufacturing—securing a competitive edge in advanced packaging.​ ​