HBM

With the rapid development of AI, HPC, and cloud computing, high-bandwidth memory (HBM) has become a core technology for accelerators, GPUs, and advanced processors. HBM significantly increase memory bandwidth and computing efficiency while effectively reducing power consumption through higher stacking layers and wider data channels. They are widely used in AI training, data centers, 5G, and advanced packaging chips.​ ​HBM yield is limited by stringent process challenges: micro-bumps and hybrid bonding require nanometer-level alignment accuracy; stacks of 8–16 layers or more place even stricter demands on warpage and thermal stress control; and high-density interconnects and sub-micron defect detection make it difficult for traditional methods to achieve both resolution and productivity.​

 CMIt is tailored for HBM packaging, providing high-resolution inspection products to ensure performance integrity. Equipped with white light interferometry technology, it accurately measures stack height, flatness, and warpage. Combined with AI defect classification, it helps clients achieve both high yield and high efficiency in HBM production.​