FOPLP

However, panel-level processing significantly increases the complexity of process control and inspection. Large panels are more susceptible to warpage, which can impact alignment accuracy and process stability. Reconstituted panels and multi-die configurations also introduce a higher risk of die shift and alignment errors. In addition, continuous scaling of RDL line width and spacing (L/S) places more stringent requirements on defect inspection capability.​​

CMIt’s inspection and metrology platforms provide high-precision surface inspection and real-time die position tracking, delivering critical data for inter-layer alignment and enabling effective compensation for warpage effects through advanced algorithms. By leveraging CAD-based comparison, the system accurately correlates actual die images with design data, allowing alignment deviations to be identified and corrected at an early stage. These capabilities help ensure process accuracy and support high yield and reliability for FOPLP in volume production environments.​​