Application

Bevel Inspection

Bevel Optical Module​​

  • The edge inspection module can operate independently or be integrated with CMIt’s existing inspection systems.




Bevel Inspection​​

  • During AOI inspection, the system can simultaneously perform Edge Side Inspection (ESI) on the next wafer, effectively increasing overall inspection throughput.​
  • ​The system is capable of detecting defects on the frontside, backside, and edge of the wafer, including edge chipping, cracks, and scratches.
  • ​​The module offers a high degree of configuration flexibility to accommodate different products and process requirements, supporting a wide range of edge inspection applications.

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