Application
Back Side Inspection
Backside Optical Module
- Backside Sensor can effectively transmittance blue tape/UV tape ,providing the strong contrast needed for high resolution imaging.
Backside Inspection
- During the AOI inspection, the back side inspection of next piece is performed simultaneously
- Increase the WPH（Wafer Per Hour）for front and back inspection
- Avoid damages caused by flipping
- High flexibility for different product inspectional applications
Frontside and Backside Wafer Data Integration
- Frontside and backside inspection data are integrated and analyzed simultaneously, delivering consolidated results that enhance data consistency and improve interpretation efficiency.
