Application
All Bump 3D Metrology
Advanced Packaging 3D Height & Warpage Control Solution
3D Metrology for Each Size Bump
- Fan-out , 2.5D IC / 3D IC Advanced Packaging
- Micro-bump (8-25μm) , C4 bump (60-80μm)
- Pillar bump (30-150μm), Solder bump (180um~250μm)
3D Measurement
- Accuracy: 60 nanometer
- Z Range: 2 ~ 500 μm
- Million Bump Metrology
- Function: Bump Height , Bump Diameter , Coplanarity
