2.5D / 3D IC Package

As heterogeneous integration technology leads the semiconductor industry, 2.5/3D IC Package have become key technologies for High-Performance Computing (HPC), AI chips, High-Bandwidth Memory (HBM), and Silicon Photonics. By chip stacking and interposer, bandwidth can be significantly increased while power consumption is reduced to meet the demands of next-generation computing.​​ ​

The 2.5/3D IC Package industry faces multiple, demanding challenges. TSV and hybrid bonding require extremely high alignment accuracy; even the slightest deviation can cause wafer stacking failure, directly impacting yield and product performance. As wafer and package sizes continue to increase, detecting high-density interconnects and tiny defects becomes increasingly challenging, making traditional inspection methods unable to fully meet these requirements.​

​ At the same time, stacked chips are prone to thermal stress and warping, which places strict requirements on the reliability of the packaging structure. The differences in thermal expansion coefficients and physical properties of different materials in heterogeneous chip integration may also lead to stress concentration and interconnection failure. Furthermore, the complexity of high-precision and high-density processes makes balancing yield and cost control in mass production a key challenge. Overall, 2.5/3D IC Packagenot only presents a high technical barrier but also demands a balance between reliability, mass production efficiency, and cost, placing unprecedented demands on process control and inspection technologies.​ ​

CMIt provides high-speed inspection and flexible handling equipments, improving production efficiency and reducing inspection bottlenecks. Furthermore, our system products measure wafer warpage and thermal stress effects, and records comprehensive measurement data to help customers optimize process and ensure reliability. Combined with AI data analysis, CMIt's inspection equipment not only detects defects instantly but also provides comprehensive process feedback, helping clients achieve higher yields and reduce costs in high-precision, high-density packaging environments.