Distribution
1995
Cheng Mei Founded
1996
WEGU (Germany) agent
1998
Mahr GmbH agent
Integration
2001
Siemens 3D Wafer Level Bumping Inspection Machine agent
2003
Initiated collaboration with Siemens on inspection and metrology solutions for IC substrate equipment.
2008
Renamed to CMIt Cheng Mei Instrument Technology Co., Ltd.
2009
Buffalo Bump inspection system successfully adopted by Tier1 Foundry
Brand Development
2010
Developed LED equipment and achieved over 60% market share as a mainstream supplier
2015
Strategic Entry into the Semiconductor 2D+3D Inspection and Metrology Equipment Market
2016
Buffalo BIS Edge Inspection System Adopted by Tier1 Foundry
2019
Formally Entered the μLED Market
2020
Became a leading inspection and metrology supplier for the μLED industry in Taiwan
2021
Strategic Expansion into the Advanced Packaging Market
2024
Launched Argus 3000 Series for RDL and μBump applications
2025
Positioning as a Top-Tier Global Provider of Inspection & Metrology Solutions in Advanced Package
