CMIt is committed to becoming a key technology partner in the global advanced packaging and μLED inspection and metrology markets. Leveraging deep expertise in optical design, a modular software platform, and AI-driven image analysis, CMIt continues to help customers enhance process yield and manufacturing efficiency, providing a stable and reliable quality foundation for advanced manufacturing.
As rapid growth in AI-driven large-scale chip applications accelerates increases in package size and process complexity, CMIt is extending its advanced packaging portfolio beyond CoWoS to next-generation technologies such as Panel-Level Packaging and CoPoS. This strategic expansion addresses the industry’s growing demand for large-area and high-density processes. In parallel, CMIt builds upon its established strengths in μLED inspection and metrology, progressively enhancing end-to-end inspection, metrology, and data integration capabilities from die to panel, enabling clients to achieve stable, high-efficiency, and high-yield mass production.
