Application

2D / 3D Metrology

2D / 3D 取樣量測

2D 量測

RDL CD/ pad CD/ bump diameter
CD value: 1.2μm~300μm

3D 量測

Height: 5μm~250μm
High AR(1:7) tall pillar height is workable

3D 量測

BH/COP 完整測量

共軛焦白光掃描

THK 薄膜厚度測量

干涉原理