Application

2D / 3D Metrology

2D / 3D 取样量测

2D 量测

RDL CD/ pad CD/ bump diameter
CD value: 1.2μm~300μm

3D 量测

Height: 5μm~250μm
High AR(1:7) tall pillar height is workable

3D 量测

BH/COP 完整测量

共轭焦白光扫描

THK 薄膜厚度测量

干涉原理